Output circuit

ABSTRACT

A low-side off-detection signal compares the gate signal of a low-side transistor with a predetermined first level to generate a low-side off-detection signal indicating that the low-side transistor is off. The low-side detection transistor is of the same type as the low-side transistor, with the source connected to the ground terminal, and the gate receiving the low-side transistor gate signal. A first resistor is arranged between the drain of the low-side detection transistor and the power supply terminal. A first bypass circuit is arranged in parallel with the first resistor, and is configured to switch to the conduction state when a control signal is a level which instructs the low-side transistor to switch off, and to switch to the cut-off state when the control signal level instructs the low-side transistor to switch on. The drain signal of the low-side detection transistor is output as the low-side off-detection signal.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an output circuit.

2. Description of the Related Art

In electronic circuits, half-bridge circuits and H-bridge circuits(which will be referred to as the “bridge output circuits” hereafter),which employ power transistors, are widely employed. The bridge outputcircuit includes a high-side transistor and a low-side transistorarranged in series between the power supply terminal and the groundterminal. By alternately switching on and off the high-side transistorand the low-side transistor, such an arrangement outputs either thepower supply voltage or the ground voltage via a connection node thatconnects these two transistors.

With such a bridge output circuit, if the high-side transistor and thelow-side transistor are switched on at the same time, shoot-throughcurrent flows from the power supply terminal to the ground terminal. Inorder to prevent such a shoot-through current, a period is establishedin which both the high-side transistor and the low-side transistor areturned off (which will also be referred to as “dead time”) between astate in which the high-side transistor is to be turned on and a statein which the low-side transistor is to be turned on.

By increasing the dead time, such an arrangement reduces the risk of asituation in which the high-side transistor and the low-side transistorare turned on at the same time. However, such an arrangement has aproblem of reduced energy efficiency. Furthermore, such increased deadtime leads to a problem of the bridge circuit having a reduced responsespeed, i.e., a problem of reduced switching speed.

RELATED ART DOCUMENTS Patent Documents

-   [Patent Document 1]

Japanese Patent Application Laid Open No. 2004-119022

-   [Patent Document 2]

Japanese Patent Application Laid Open No. 2005-304226

-   [Patent Document 3]

Japanese Patent Application Laid Open No. 2001-160615

-   [Patent Document 4]

Japanese Patent Application Laid Open No. 2007-209054

Problem 1. Patent document 2 discloses another method for preventingshoot-through current, which is a different method from theaforementioned method using dead time. With the technique disclosed inPatent document 2, the gate signal for the low-side transistor and thegate signal for the high-side transistor are cross-coupled.Specifically, a logical operation is performed on a control signal forthe high-side transistor and the gate signal for the low-side transistorso as to generate the gate signal for the high-side transistor. In thesame way, a logical operation is performed on a control signal for thelow-side transistor and the gate signal for the high-side transistor soas to generate the gate signal for the low-side transistor.

With such a method, the gate signal of the high-side transistor ismonitored, and after it is detected that the high-side transistor hasdefinitely been turned off, the high-side transistor is turned on. Inthe same way, the gate signal of the low-side transistor is monitored,and after it is detected that the low-side transistor has definitelybeen turned on, the high-side transistor is turned on. With such amethod, the period of time in which both the high-side transistor andthe low-side transistor are turned off at the same time can be reducedwhile preventing shoot-through current. Thus, such an arrangement isadvantageous from the viewpoint of energy efficiency.

In order to further improve the operating speed and efficiency, there isa need to monitor the gate signal of the high-side transistor and thegate signal of the low-side transistor, and to detect, at high speed andwith high precision, the timing at which each transistor is turned off.

Problem 2. In the field of electronic circuits, half-bridge circuits,H-bridge circuits, and source follower circuits are widely employed.FIG. 7 is a circuit diagram which shows the configuration of a typicalhalf-bridge circuit 200. The half-bridge circuit 200 outputs, via anoutput terminal POUT, either the power supply voltage Vdd or the groundvoltage (0 V), or an intermediate voltage between the two.

The half-bridge circuit 200 includes a high-side transistor M1H and alow-side transistor M1L which each function as a power transistor, andpre-drivers 202 and 204 configured to drive these power transistors. Thehigh-side transistor M1H and the low-side transistor M1L are connectedin series between the power supply terminal PVDD and the ground linePGND. The high-side transistor M1H is an N-channel MOSFET (Metal OxideSemiconductor Field Effect Transistor), and the low-side transistor M11,is a P-channel MOSFET.

The pre-drivers 202 and 204 switch on the high-side transistor M1H andthe low-side transistor M11, in a complementary manner according to acontrol signal S11. When the high-side transistor M1H is switched to theON state, the output voltage Vout is switched to the power supplyvoltage Vdd, and when the low-side transistor M11, is switched to the ONstate, the output voltage Vout is switched to the ground voltage 0 [V].

The pre-driver 202 of the high-side block supplies, to a controlterminal (gate) of the high-side transistor M1H, a gate voltage Vg1 atthe high level (Vdd) or the low level (VL) according to the controlsignal S11. Similarly, the pre-driver 204 of the low-side blocksupplies, to the gate of the low-side transistor M1L, a gate voltage Vg2at the high level (VH) or the low level (0 V) according to the controlsignal S11.

There is a need to determine the electric potential VL of the low levelof the gate voltage Vg1 giving consideration to the gate-sourcebreakdown voltage of the high-side transistor M1H. Specifically, the lowlevel voltage VL of the gate voltage Vg1 is designed such that thegate-source voltage (Vdd−VL) does not exceed the gate-source breakdownvoltage.

In general, each of the pre-drivers 202 and 204 includes a CMOSinverter. In FIG. 7, the pre-driver 202 includes two transistors M12 andM13 arranged in series between the power supply voltage Vdd and thelow-level voltage VL. The low-level voltage VL may be a voltagegenerated by a constant voltage circuit such as an unshown regulator orthe like, or may be the ground voltage.

Description will be made regarding the operation of such an arrangementwhen the high-side transistor M1H is switched from the OFF state to theON state.

When the high-side transistor M1H is switched to the OFF state, thepre-driver 202 switches the gate voltage Vg1 of the high-side transistorM1H from high level (Vdd) to low level (VL). Directing attention to theinternal configuration of the pre-driver 202, the state of thepre-driver 202 is switched from the state in which the transistor M12 isON and the transistor M13 is OFF to the state in which the transistorM12 is OFF and the transistor M13 is ON.

Such a transition involves a steep current impulse IM3 flowing throughthe transistor M13 due to the gate capacitance of the high-sidetransistor M1H. In this case, when the feedback speed of the constantvoltage circuit is insufficient, the low level voltage VL temporarilyrises. The increase in the low level voltage VL leads to an increase inthe gate voltage Vg1. Accordingly, in this case, the voltage between thegate and source of the high-side transistor M1H becomes lower than athreshold voltage Vt, leading to a malfunction in which the high-sidetransistor M1H is switched to the OFF state at an unintended timing.

As an approach for resolving this problem, a method is known in which alow performance device is employed as the pre-driver 202. That is tosay, a device with a large ON resistance (a small size MOSFET or abipolar transistor) is employed as the transistor M13. With such anarrangement, the current that flows into the constant voltage circuitvia the transistor M13 is limited, thereby suppressing an increase inthe low level voltage VL. However, such an approach reduces theswitching speed of the high-side transistor M1H, which is a problem.

Such a problem can occur in the low-side transistor M1L. Also, such aproblem can occur in an H-bridge circuit or a source follower circuit.

SUMMARY OF THE INVENTION

1. An embodiment of the present invention has been made principally inorder to solve the problem 1. Accordingly, it is an exemplary purpose ofthe present invention to provide a bridge output circuit which iscapable of detecting, at high speed, a timing at which a high-sidetransistor switches off and a timing at which a low-side transistorswitches off.

An embodiment of the present invention relates to a bridge outputcircuit configured to output, via an output terminal, an output signalhaving a voltage level that corresponds to a control signal. The bridgeoutput circuit comprises: a high-side transistor arranged between afirst fixed voltage terminal and the output terminal; a low-sidetransistor arranged between the output terminal and a second fixedvoltage terminal; a low-side off-detection circuit configured to comparea gate signal of the low-side transistor with a predetermined firstlevel so as to detect whether or not the low-side transistor is off, andto generate a low-side off-detection signal which is asserted when it isdetected that the low-side transistor is off; a high-side off-detectioncircuit configured to compare a gate signal of the high-side transistorwith a predetermined second level so as to detect whether or not thehigh-side transistor is off, and to generate a high-side off-detectionsignal which is asserted when it is detected that the high-sidetransistor is off; a high-side driver configured to generate the gatesignal for the high-side transistor according to the control signal andthe low-side off-detection signal; a low-side driver configured togenerate the gate signal for the low-side transistor according to thecontrol signal and the high-side off-detection signal. The low-sideoff-detection circuit comprises: a low-side detection transistor that isof the same type as the low-side transistor, a first terminal of whichis connected to the second fixed voltage terminal, and which isconfigured to receive, via a gate thereof, the gate signal of thelow-side transistor; a first resistor arranged between a second terminalof the low-side detection transistor and a third fixed voltage terminal;and a first bypass circuit arranged in parallel with the first resistor,and configured to switch to a conduction state when the control signalis set to a level which instructs the low-side transistor to switch off,and to switch to a cut-off state when the control signal is set to alevel which instructs the low-side transistor to switch on. With thelow-side off-detection circuit, a signal output via the second terminalof the low-side detection transistor is output as the low-sideoff-detection signal.

With the first low-side off-detection circuit, before the timing atwhich the gate signal of the low-side transistor switches from a levelwhich instructs the low-side transistor to switch on, to a level whichinstructs the low-side transistor to switch off, the first bypasscircuit is switched to the conduction state. In this state, the combinedresistance connected to the low-side detection transistor is reduced,thereby raising the response speed. Furthermore, when the low-sidetransistor and the first low-side detection transistor are on, the firstbypass circuit is set to a cut-off state. Thus, such an arrangementreduces a current that flows from the second terminal via the low-sidedetection transistor.

Also, the high-side off-detection circuit may comprise: a high-sidedetection transistor that is of the same type as the high-sidetransistor, and arranged such that a first terminal thereof is connectedto the first fixed voltage terminal, and the gate signal of thehigh-side transistor is received via a gate thereof; a second resistorarranged between a second terminal of the high-side detection transistorand a fourth fixed voltage terminal; and a second bypass circuitarranged in parallel with the second resistor, and configured to switchto a conduction state when the control signal is set to a level whichinstructs the high-side transistor to switch off, and to switch to acut-off state when the control signal is set to a level which instructsthe high-side transistor to switch on. With the high-side off-detectioncircuit, a signal output via the second terminal of the high-sidedetection transistor may be output as the low-side off-detection signal.

By employing such a first low-side off-detection circuit, such anembodiment is capable of detecting, at high speed, that the low-sidetransistor has switched off. Furthermore, such an arrangement reducespower consumption in the first low-side off-detection circuit.

Also, the first bypass circuit may comprise: a first bypass resistorhaving a smaller resistance value than that of the first resistor; and afirst switch arranged in series with the first bypass resistor, andconfigured to switch on and off according to the control signal.

Also, the second bypass circuit may comprise: a second bypass resistorhaving a smaller resistance value than that of the second resistor; anda second switch arranged in series with the second bypass resistor, andconfigured to switch on and off according to the control signal.

2. Another embodiment of the present invention has been made principallyin order to solve the problem 2. It is an exemplary purpose of thepresent invention to provide an output circuit which is capable ofswitching on and off with high speed.

An embodiment of the present invention relates to an output circuitconfigured to output, via an output terminal thereof, a voltage thatcorresponds to a control signal. The output circuit comprises: an outputtransistor arranged between the output terminal and a first terminalwhich has a fixed electric potential; a first resistor arranged betweena gate of the output transistor and the first terminal; a first ONcircuit arranged between the gate of the output transistor and a secondterminal which has a fixed electric potential; and a second ON circuitarranged between the gate of the output transistor and a third terminalwhich has a fixed electric potential. With such an arrangement, when anON control signal, which instructs the output transistor to switch on,is asserted, both the first and second ON transistors are turned on,following which the first ON transistor is turned off.

With such an embodiment, the current that flows through the first ONtransistor and the current that flows through the second ON transistorare combined, and the combined current flows through the first resistor.Thus, after the ON control signal is asserted, the voltage drop thatoccurs at the first terminal temporarily becomes larger, therebyaccelerating the turn-on speed of the output transistor. Subsequently,the first ON transistor is turned off, and accordingly, the current thatflows through the first resistor is reduced, thereby reducing the powerconsumption.

Also, the first ON circuit may comprise a gate voltage monitoring unitconfigured to monitor the voltage difference between the gate of theoutput transistor and the first terminal, and to generate an OFF signalwhich is asserted when the voltage difference thus monitored reaches apredetermined value, thereby turning off the first ON transistor. Withsuch an arrangement, the first ON transistor may be controlled accordingto the ON control signal and the OFF signal.

Also, the first ON circuit may comprise a delay circuit configured togenerate an OFF signal which is asserted after a predetermined period oftime elapses after the ON control signal is asserted. With such anarrangement, the first ON transistor may be controlled according to theON control signal and the OFF signal.

Also, the first ON circuit may comprise a second resistor arranged inseries with the first ON transistor.

Also, the second ON transistor may be configured to generate apredetermined constant current when the ON control signal is asserted.With such an arrangement, during a period of time in which the first ONtransistor is off and the second ON transistor is on, the gate voltageof the output transistor is stabilized at a voltage represented byVdd−R1×Ic. Here, Vdd represents the electric potential at the firstterminal, R1 represents the resistance value of the first resistor, andIc represents the value of the constant current.

Also, the output circuit according to an embodiment may further comprisea clamp circuit configured to clamp the voltage difference between thegate of the output transistor and the first terminal to a predeterminedvalue.

By providing such a clamp circuit, such an arrangement is capable ofprotecting the output transistor.

It is to be noted that any arbitrary combination or rearrangement of theabove-described structural components and so forth is effective as andencompassed by the present embodiments.

Moreover, this summary of the invention does not necessarily describeall necessary features so that the invention may also be asub-combination of these described features.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will now be described, by way of example only, withreference to the accompanying drawings which are meant to be exemplary,not limiting, and wherein like elements are numbered alike in severalFigures, in which:

FIG. 1 is a circuit diagram which shows a configuration of a bridgeoutput circuit according to a first embodiment;

FIGS. 2A and 2B are circuit diagrams which respectively show a low-sideoff-detection circuit and a high-side off-detection circuit shown inFIG. 1;

FIG. 3 is a time chart which shows the operation of a bridge outputcircuit shown in FIG. 1;

FIG. 4 is a circuit diagram which shows a configuration of a low-sideoff-detection circuit according to a modification;

FIG. 5 is a circuit diagram which shows a configuration of a bridgeoutput circuit according to a modification;

FIG. 6 is a circuit diagram which shows an example configuration of ahigh-side off-detection circuit shown in FIG. 5;

FIG. 7 is a circuit diagram which shows a configuration of a typicalhalf-bridge circuit;

FIG. 8 is a circuit diagram which shows a configuration of an outputcircuit according to a second embodiment;

FIG. 9 is a time chart which shows the operation of the output circuitshown in FIG. 8; and

FIG. 10 is a circuit diagram which shows a configuration of an outputcircuit according to a modification.

DETAILED DESCRIPTION OF THE INVENTION

The invention will now be described based on preferred embodiments whichdo not intend to limit the scope of the present invention but exemplifythe invention. All of the features and the combinations thereofdescribed in the embodiment are not necessarily essential to theinvention.

In the present specification, a state represented by the phrase “themember A is connected to the member B” includes a state in which themember A is indirectly connected to the member B via another member thatdoes not affect the electric connection therebetween, in addition to astate in which the member A is physically and directly connected to themember B.

Similarly, a state represented by the phrase “the member C is providedbetween the member A and the member B” includes a state in which themember A is indirectly connected to the member C, or the member B isindirectly connected to the member C via another member that does notaffect the electric connection therebetween, in addition to a state inwhich the member A is directly connected to the member C, or the memberB is directly connected to the member C.

[First Embodiment]

FIG. 1 is a circuit diagram which shows a configuration of a bridgeoutput circuit 100 according to a first embodiment. The bridge outputcircuit 100 receives a control signal SIN via an input terminal 102, andoutputs, via an output terminal 104, an output signal SOUT having avoltage level that corresponds to the level of the control signal SIN.With the present embodiment, when the control signal SIN is high level,the output signal SOUT is set to the power supply voltage Vdd, and whenthe control signal SIN is low level, the output signal SOUT is set tothe ground voltage (0 V).

The bridge circuit 100 includes a high-side transistor M1, a low-sidetransistor M2, a low-side off-detection circuit 10, a high-sideoff-detection circuit 20, a high-side driver 30, and a low-side driver40.

The high-side transistor M1 is arranged between a first fixed voltageterminal (power supply terminal 106) and the output terminal 104. Thelow-side transistor M2 is arranged between the output terminal 104 andthe second fixed voltage terminal (ground terminal 108). The high-sidetransistor M1 and the low-side transistor M2 form a so-calledhalf-bridge circuit.

When the high-side transistor M1 is on and the low-side transistor M2 isoff, the output signal SOUT output via the output terminal 104 is set tothe power supply voltage Vdd. When the high-side transistor M1 is offand the low-side transistor M2 is on, the output signal SOUT is set tothe ground voltage (0 V).

The low-side off-detection circuit 10 compares the voltage level of agate signal SGL of the low-side transistor M2 with a predetermined firstlevel THL so as to detect whether or not the low-side transistor M2 isoff. The low-side off-detection circuit 10 generates a low-sideoff-detection signal S1 which is asserted (set to high level) when it isdetected that the low-side transistor M2 is off.

The high-side off-detection circuit 20 compares the voltage level of agate signal SGH of the high-side transistor M1 with a predeterminedsecond level THH so as to detect whether or not the high-side transistorM1 is off. The high-side off-detection circuit 20 generates a high-sideoff-detection signal S2 which is asserted (set to low level) when thehigh-side off-detection circuit 20 detects that the high-side transistorM1 is off. The inverter 24 inverts the high-side off-detection signalS2. The inverted high-side off-detection signal #S2 (“#” representslogical inversion) is switched to high level at the same time as thehigh-side transistor M1 is switched to the off state.

The high-side driver 30 generates the gate signal SGH for the high-sidetransistor M1 based upon the control signal SIN and the low-sideoff-detection signal S1.

When the control signal SIN is high level and the low-side off-detectionsignal S1 is asserted (set to high level), the gate signal SGH is set toa level (low level) which turns on the high-side transistor M1. In othercases, the gate signal SGH is set to a level (high level) which turnsoff the high-side transistor M1.

The high-side driver 30 includes a NAND gate 32, inverters 36 and 38,and transistors M3 and M9.

The NAND gate 32 generates the logical NAND of the control signal SINand the low-side off-detection signal S1, thereby generating a logicalNAND signal SGH′. The inverters 36 and 38 are connected in series, andinvert and amplify the output signal SGH′ of the NAND gate 32 insequence. The gate signal SGH is set to the same logical level as thatof the output signal of the NAND gate 32. The inverters 36 and 38 eachhave a typical configuration, and respectively include a pair oftransistors M11 and M12 and a pair of transistors M5 and M6.

In order to provide a high-speed operation of turning off the high-sidetransistor M1, the transistor M3 is arranged between the gate and thesource of the high-side transistor M1. When the transistor M3 is turnedon, the voltage between the gate and the source of the high-sidetransistor M1 is set to 0 V, thereby immediately turning off thehigh-side transistor M1.

The transistor M9 is arranged between the inverters 36 and 38, and isprovided in order to allow the electric potential at the connection nodewhich connects the two inverters to be rapidly switched to low level.That is to say, as with the transistor M3, the transistor M9 provides afunction of rapidly turning off the high-side transistor M1.

The low-side driver 40 generates the gate signal SGL for the low-sidetransistor M2 based upon the control signal SIN and the high-sideoff-detection signal S2.

When the control signal SIN is low level and the high-side off-detectionsignal S2 is asserted (set to low level), the gate signal SGL is set toa level (high level) which turns on the low-side transistor M2. In othercases, the gate signal SGL is set to a level (low level) which turns offthe low-side transistor M2.

The low-side driver 40 includes an inverter 42, an AND gate 44,inverters 46 and 48, and transistors M4 and M10.

The inverter 42 inverts the control signal SIN. The AND gate 44generates the logical AND of the inverted control signal # SIN and theinverted high-side off-detection signal #S2, thereby generating alogical AND signal SGL'. The inverters 46 and 48 are connected inseries, and invert and amplify the output signal SGL′ of the AND gate 44in sequence. The inverters 46 and 48 each have typical configurations,and respectively include a pair of transistors M13 and M14 and a pair oftransistors M7 and M8.

In order to provide a high-speed operation of turning off the low-sidetransistor M2, the transistor M4 is arranged between the gate and thesource of the low-side transistor M2. When the transistor M4 is turnedon, the voltage between the gate and the source of the low-sidetransistor M2 is set to 0 V, thereby immediately turning off thelow-side transistor M2.

The transistor M10 is arranged between the inverters 46 and 48, which isprovided in order to allow the electric potential at the connection nodewhich connects the two inverters to be rapidly switched to high level.That is to say, as with the transistor M4, the transistor M10 provides afunction of rapidly turning off the low-side transistor M2.

FIGS. 2A and 2B are circuit diagrams which respectively show theconfigurations of the low-side off-detection circuit 10, and thehigh-side off-detection circuit 20 shown in FIG. 1.

The low-side off-detection circuit 10 shown in FIG. 2A includes alow-side detection transistor MsL, a first resistor R11, and a firstbypass circuit 12. The low-side detection transistor MsL is configuredas an N-channel MOSFET that is of the same type as the low-sidetransistor M2. The first terminal (source) of the low-side detectiontransistor MsL is connected to the second fixed voltage terminal (groundterminal 108), and the gate signal SGL of the low-side transistor M2 isinput to the gate of the low-side detection transistor.

The first resistor R11 is arranged between the second terminal (drain)of the low-side detection transistor MsL and a third fixed voltageterminal (power supply terminal 106). The gate-source threshold voltageof the low-side detection transistor MsL corresponds to theaforementioned first level THL, and is preferably the same as thegate-source threshold voltage Vtn of the low-side transistor M2. That isto say, the on and off states of the low-side detection transistor MsLfollow the on and off states of the low-side transistor M2.

The first bypass circuit 12 is arranged in parallel with the firstresistor R11. When the control signal SIN is set to a level (high level)which instructs the low-side transistor M2 to switch off, the firstbypass circuit 12 is switched off. When the control signal SIN is set toa level (low level) which instructs the low-side transistor M2 to switchon, the first bypass circuit 12 is switched on. A resistor component isincluded on a path of the first bypass circuit 12, the resistance ofwhich is smaller than that of the first resistor R11.

The first bypass circuit 12 includes a first bypass resistor R12 havinga smaller resistance value than that of the first resistor R11, and afirst switch Msw1 arranged in series with the first bypass resistor R12.The first bypass circuit 12 is switched on and off according to thecontrol signal # SIN.

As the low-side off-detection signal S1, the low-side off-detectioncircuit 10 outputs the signal output via a second terminal (drain) ofthe low-side detection transistor MsL.

With the low-side off-detection circuit 10 shown in FIG. 2A, bycomparing the voltage level of the gate signal SGL with the first levelTHL (=Vtn), such an arrangement is capable of detecting whether thelow-side transistor M2 is on or off.

The high-side off-detection circuit 20 shown in FIG. 2B includes ahigh-side detection transistor MsH, a second resistor R21, and a secondbypass circuit 22.

The high-side detection transistor MsH is configured as a P-channelMOSFET that is of the same type as the high-side transistor M1. Thefirst terminal (source) of the high-side detection transistor MsH isconnected to the first fixed voltage terminal (power supply terminal106), and the gate signal SGH of the high-side transistor M1 is input tothe gate of the high-side detection transistor MsH.

The second resistor R21 is arranged between the second terminal (drain)of the high-side detection transistor MsH and a fourth fixed voltageterminal (ground terminal 108).

The gate-source threshold voltage of the high-side detection transistorMsH corresponds to the aforementioned second level THH, and ispreferably the same as the gate-source threshold voltage Vtp of thehigh-side transistor M1. That is to say, the on and off states of thehigh-side detection transistor MsH follow the on and off states of thehigh-side transistor M1.

The second bypass circuit 22 is arranged in parallel with the secondresistor R21. When the control signal SIN is set to a level (low level)which instructs the high-side transistor M1 to switch off, the secondbypass circuit 22 is switched on. When the control signal SIN is set toa level (high level) which instructs the high-side transistor M1 toswitch on, the first bypass circuit 12 is switched off. A resistorcomponent is included on a path of the second bypass circuit 22, theresistance of which is smaller than that of the second resistor R21.

The second bypass circuit 22 includes a second bypass resistor R22having a smaller resistance value than that of the second resistor R21,and a second switch Msw2 arranged in series with the second bypassresistor R22, and the ON/OFF state of which is switched according to thecontrol signal SIN.

The high-side off-detection circuit 20 outputs, as the high-sideoff-detection signal S2, a signal output via a second terminal (drain)of the high-side detection transistor MsH. With the high-sideoff-detection circuit 20 shown in FIG. 2B, by comparing the voltagelevel of the gate signal SGH with the second level THH (=Vdd−Vtp), suchan arrangement is capable of detecting whether the high-side transistorM1 is on or off.

Next, description will be made regarding the operation of the bridgeoutput circuit 100. FIG. 3 is a time chart which shows the operation ofthe bridge output circuit 100 shown in FIG. 3. Before the time point t0,the control signal SIN is low level, the high-side transistor M1 is off,and the low-side transistor M2 is on.

At the time point t0, the control signal SIN is switched from low levelto high level, which instructs the high-side transistor M1 to switch onand the low-side transistor M2 to switch off.

When the control signal SIN has been switched on, the gate signal SGL ofthe low-side transistor M2 is switched from high level (Vdd) to lowlevel (0 V). When the voltage level of the gate signal SGL becomes lowerthan the threshold voltage Vtn at the time point t1, the low-sidetransistor M2 is turned off, and the low-side off-detection signal S1 isasserted by the low-side off-detection circuit 10.

When the low-side off-detection signal S1 is asserted, the gate signalSGH of the high-side transistor M1 starts to switch from high level(Vdd) to low level (0 V). When the voltage level of the gate signal SGHbecomes lower than the second threshold value THH (=Vdd−Vtp) at the timepoint t2, the high-side transistor M1 is turned on.

At the time point t3, the control signal SIN is switched from high levelto low level, which instructs the high-side transistor M1 to switch offand the low-side transistor M2 to switch on. In the period between thetime points t3 and t5, similar processing is executed by the high-sideoff-detection circuit 20 in the same way as in the period between thetime points t0 and t2.

The above is the operation of the bridge output circuit 100.

With the bridge output circuit 100, the period between the time pointst1 and t2 and the period between the time points t4 and t5 each functionas dead time during which the high-side transistor M1 and the low-sidetransistor M2 are simultaneously off.

With the low-side off-detection circuit 10 and the high-sideoff-detection circuit 20 shown in FIGS. 2A and 2B, transition from on tooff can be detected at high speed with respect to the low-sidetransistor M2 and the high-side transistor M1. Thus, such an arrangementenables the dead time to be reduced, thereby improving the circuitefficiency.

The low-side off-detection circuit 10 is a circuit configured to detectthe switching from on to off of the low-side transistor M2. Accordingly,the low-side off-detection circuit 10 preferably has the followingcharacteristics.

[Characteristic 1]

The low-side off-detection circuit 10 operates at high speed during aperiod in which the low-side transistor M2 is on.

[Characteristic 2]

The low-side off-detection circuit 10 does not need to operate during aperiod in which the low-side transistor M2 is off. Accordingly, thepower consumption of the low-side off-detection circuit 10 is preferablysmall during the period in which the low-side transistor M2 is off.

With the low-side off-detection circuit 10 shown in FIG. 2A, during aperiod in which the control signal # SIN is high level (SIN is lowlevel), i.e., during a period in which the low-side transistor M2 isoff, the first switch Msw1 is off. Thus, such an arrangement reduces thecurrent flowing from the power supply terminal 106 to the groundterminal 108 in the low-side off-detection circuit 10. That is to say,such an arrangement provides the advantage noted above as“characteristic 2”.

Furthermore, during a period in which the control signal # SIN is lowlevel (SIN is high level), i.e., during a period in which the low-sidetransistor M2 is on, the first switch MsW1 is also on. Accordingly, theimpedance of the load connected to the drain of the low-side detectiontransistor MsL becomes low, thereby raising the response speed of thelow-side off-detection circuit 10. That is to say, such an arrangementprovides the advantage noted above as “characteristic 1”.

The high-side off-detection circuit 20 is a circuit configured to detectthe switching from on to off of the high-side transistor M1 f.Accordingly, the high-side off-detection circuit 20 preferably has thefollowing characteristics.

[Characteristic 3]

The high-side off-detection circuit 20 operates at high speed during aperiod in which the high-side transistor M1 is on.

[Characteristic 4]

The high-side off-detection circuit 20 does not need to operate during aperiod in which the high-side transistor M1 is off. Accordingly, thepower consumption of the high-side off-detection circuit 20 ispreferably small during the period in which the high-side transistor M1is off.

The high-side off-detection circuit 20 shown in FIG. 2B provides thecharacteristics 3 and 4.

Furthermore, in FIG. 1, the output impedance (ON resistance R) of eachtransistor preferably satisfies the following relations. Each indexnumber represents the identification number of the correspondingtransistor.

RM3<RM6

RM9<RM11

RM4<RM7

RM10<RM14

By determining the size of each transistor such that the aforementionedrelations are satisfied, such an arrangement is capable of preventing,in a surer manner, a state in which the high-side transistor M1 and thelow-side transistor M2 are simultaneously on.

[Modification]

FIG. 4 is a circuit diagram which shows a configuration of a low-sideoff-detection circuit 10 a according to a modification.

The low-side off-detection circuit 10 a includes transistors M20 throughM23, and an inverter 50. The transistors M21 through M23 are eachconfigured as a transistor that is of the same type (N-channel MOSFET)as the low-side transistor M2. The transistor M22 is configured as aP-channel MOSFET.

The transistors M20 through M22 are connected in order in series betweenthe power supply terminal 106 and the ground terminal 108. The gatesignal SGL of the low-side transistor M2 is input to the gates of thetransistors M20 through M22. The inverter 50 inverts a signal output viaa connection node that connects the transistor M20 and M21, and outputsthe signal thus inverted as the low-side off-detection signal S1. Thetransistor M23 is arranged in parallel with the transistor M22. Thelow-side off-detection signal S1 is input to the gate of the transistorM23. The low-side off-detection circuit 10 a compares the gate signalSGL with the first threshold value THL, and generates the low-sideoff-detection according to the comparison results.

With the low-side off-detection circuit 10 a, the dead time can bereduced in the same way as with the low-side off-detection circuit 10shown in FIG. 2A, thereby improving energy efficiency. Furthermore, byadjusting the gate length and the gate width of each transistor, thelow-side off-detection circuit 10 a allows the first threshold value THLto be adjusted. Furthermore, such an arrangement allows the firstthreshold value THL to have hysteresis characteristics, therebyimproving noise resistance.

The high-side off-detection circuit 20 according to a modification canbe configured by replacing the P-channel MOSFET with an N-channelMOSFET, and by inverting the arrangement of the power supply terminal106 and the ground terminal 108, which can be conceived by those skilledin this art.

FIG. 5 is a circuit diagram which shows a configuration of a bridgeoutput circuit 100 b according to a modification. Description will bemade regarding the bridge output circuit 100 b shown in FIG. 5, focusingon how it differs from the bridge output circuit 100 shown in FIG. 1.

The high-side transistor M1 shown in FIG. 1 is configured as a P-channelMOSFET. In contrast, the high-side transistor M1 shown in FIG. 5 isconfigured as an N-channel MOSFET.

The bridge output circuit 100 b shown in FIG. 5 includes two powersupply terminals 106 and 107, via which power supply voltages VCC1 andVCC2 are supplied. It should be noted that VCC1>VCC2.

The low-side block has the same configuration as that of the low-sideblock shown in FIG. 1.

In order to turn on the high-side transistor M1 configured as anN-channel MOSFET, the gate signal SGH to be applied to the gate of thehigh-side transistor M1 must be set to a higher electric potential than(VCC1+Vtn). Here, Vtn represents the gate-source threshold voltage ofthe high-side transistor M1. A high-side driver 30 b generates the gatesignal SGH, which is set to the power supply voltage VCC2 when thehigh-side transistor M1 is to be turned on, and which is set to theground voltage (0 V) when the high-side transistor M1 is to be turnedoff. That is to say, the relation VCC2>VCC1+Vtn is satisfied.

An AND gate 33 generates the logical AND of the control signal SIN andthe low-side off-detection signal S1, thereby outputting a logical ANDsignal SGH′. The logical AND signal SGH′ is set to either VCC1 or 0 V.

A level shifter circuit LS1 converts the gate signal SGH′, whichswitches between VCC1 and 0 V, into a gate signal SGH″ which switchesbetween VCC2 and 0 V. The power supply voltage VCC2 is supplied to theinverters 36 and 38. The inverters 36 and 38 invert the gate signal SGH″in sequence.

FIG. 6 is a circuit diagram which shows an example configuration of ahigh-side off-detection circuit 20 b shown in FIG. 5.

The high-side off-detection circuit 20 b includes a high-side detectiontransistor MsH, a second resistor R31, and a second bypass circuit 22 b.

The high-side detection transistor MsH is configured as an N-channelMOSFET which is of the same type as the high-side transistor M1. Thefirst terminal (source) of the high-side detection transistor MsH isconnected to the output terminal 104. The gate signal SGH of thehigh-side transistor M1 is input to the gate of the high-side detectiontransistor MsH.

The second resistor R31 is arranged between the second terminal (drain)of the high-side detection transistor MsH and the power supply terminal107. The ON/OFF operation of the high-side transistor MsH follows theON/OFF operation of the high-side transistor M1.

The second bypass circuit 22 b is arranged in parallel with the secondresistor R31. When the control signal SIN is set to a level (high level)which instructs the high-side transistor M1 to switch off, the secondbypass circuit 22 b is set to the conduction state. When the controlsignal SIN is set to a level (low level) which instructs the high-sidetransistor M1 to switch on, the second bypass circuit 22 b is set to thecut-off state. A resistor component is arranged on a path of the secondbypass circuit 22 b, the resistance of which is smaller resistance thanthat of the second resistor R31.

The second bypass circuit 22 b includes a second bypass resistor R32having a smaller resistance value than that of the second resistor R31,and a second switch Msw2 arranged in series with the second bypassresistor R32, and the ON/OFF state of which is switched according to theinverted control signal # SIN.

A level shifter circuit LS2 level-shifts the inverted control signal #SIN, and applies the signal thus level-shifted to the gate of the secondswitch Msw2. A level shifter circuit LS3 level-shifts a signal S2′,which switches between VCC2 and 0 V, into the high-side off-detectionsignal S2 which switches between VCC1 and 0 V.

With the high-side off-detection circuit 20 shown in FIG. 6, the voltagelevel of the gate signal SGH is compared with the second level THH(=VCC1+Vtn), thereby detecting the ON/OFF state of the high-sidetransistor M1.

With the bridge output circuit 100 b shown in FIG. 5, shoot-throughcurrent that flows through the high-side transistor M1 and the low-sidetransistor M2 can be prevented in the same way as with the bridge outputcircuit 100 shown in FIG. 1. Furthermore, such an arrangement is capableof reducing the time in which both the transistors are simultaneouslyoff, thereby improving the energy efficiency.

Description has been made regarding an embodiment of the presentinvention with reference to the first embodiment. The above-describedembodiment has been described for exemplary purposes only, and is by nomeans intended to be interpreted restrictively. Rather, it can bereadily conceived by those skilled in this art that variousmodifications may be made by making various combinations of theaforementioned components or processes, which are also encompassed inthe technical scope of the present invention. Description will be madebelow regarding such modifications.

Description has been made in the embodiment regarding a half-bridgecircuit as an example. Also, the present invention can be effectivelyapplied to a full-bridge configuration including two pairs ofhalf-bridge circuits.

For example, the output circuit according to the embodiment can besuitably employed in motor drivers, switching regulators, lightinginverters for discharge lamps, digital audio amplifiers, etc.

[Second Embodiment]

FIG. 8 is a circuit diagram which shows a configuration of an outputcircuit 100 according to a second embodiment. Via its output terminalPOUT, the output circuit 100 outputs either the power supply voltage Vddor another voltage (e.g., ground voltage) that differs from the powersupply voltage Vdd, according to the levels of an on-control signal SONand an off-control signal SOFF. The output circuit 100 is a portion of ahalf-bridge circuit, a portion of an H-bridge circuit, or a portion of asource follower circuit.

The output circuit 100 includes: an output power transistor (which willsimply be referred to as the “output transistor” hereafter) M1, a firstresistor R1, a first ON circuit 110, a second ON circuit 120, an OFFcircuit 130, a first clamp circuit 140, and a second clamp circuit 142.The circuit portion of the bridge output circuit 100, with the exceptionof the high-side transistor M1, will be referred to as a “high-sidedriver 30 c”.

The output transistor M1 is arranged between the output terminal POUTand a first terminal (power supply terminal PVDD) which has a fixedelectric potential. The output transistor M1 is configured as aP-channel MOSFET. The source of the output transistor M1 is connected tothe power supply terminal PVDD, and the drain thereof is connected tothe output terminal POUT.

The OFF circuit 130 is provided in order to provide a function ofturning off the output transistor M1. The OFF circuit 130 receives theOFF control signal SOFF which is asserted (set to high level) during aperiod of time in which the output transistor M1 is to be turned off.The OFF circuit 130 includes an OFF transistor MOFF arranged between thegate and the source of the output transistor M1. When the OFF controlsignal SOFF is asserted, the OFF transistor MOFF is turned on. In thisstate, the gate-source voltage of the output transistor M1 becomessmaller than the threshold voltage Vt of the MOSFET, thereby turning offthe output transistor M1.

The first resistor R1, the first ON circuit 110, and the second ONcircuit 120 form an ON circuit provided in order to provide a functionof turning on the output transistor M1. The ON circuit thus formedreceive the ON control signal SON which is asserted (set to high level)during a period of time in which the output transistor M1 is to be setto the ON state.

The first resistor R1 is arranged between the gate of the outputtransistor M1 and the first terminal (power supply terminal PVDD).

The first ON circuit 110 includes a first ON transistor MON1 arrangedbetween the gate of the output transistor M1 and a second terminal P2which has a fixed electric potential. The current that flows through thefirst ON transistor MON1 will be referred to as “first current ION1”.

The second ON circuit 120 includes a second ON transistor MON2 arrangedbetween the gate of the output transistor M1 and a third terminal whichhas a fixed electric potential. The second terminal P2 and the thirdterminal P3 may be set to a common fixed electric potential VL. Also,the second terminal P2 and the third terminal P3 may be set to differentelectric potentials. For example, the second terminal P2 and the thirdterminal P3 may each be configured as the ground terminal. The currentthat flows through the second ON transistor MON2 will be referred to asthe “second current ION2”.

When the ON control signal SON is asserted, the output circuit 100instructs each of the first ON transistor MON1 and the second ONtransistor MON2 to switch on. Subsequently, the output circuit 100 turnsoff the first ON transistor MON1.

More specifically, the first ON circuit 110 includes an AND gate 112 anda gate voltage monitoring unit 114, in addition to the first ONtransistor MON1.

The gate voltage monitoring unit 114 monitors the voltage difference ΔVbetween the gate of the output transistor M1 and the first terminal(power supply terminal PVDD), i.e., monitors the gate-source voltage Vgsof the output transistor M1. The gate voltage monitoring unit 114generates an OFF signal S12 which instructs the first ON transistor MON1to switch off, according to the monitoring result. When the voltagedifference Vgs reaches a predetermined value Vth1, the gate voltagemonitoring unit 114 asserts the OFF signal S12 (switches the OFF signalS12 to low level). The gate voltage monitoring unit 114 operates with adelay τ1. With such an arrangement, after the delay τ1 elapses after thegate-source voltage Vgs reaches the threshold voltage Vth1, the OFFsignal S12 is asserted. The threshold value Vth1 is optimized givingconsideration to the delay τ1.

The AND gate 112 generated the logical AND of the OFF signal S12 and theON control signal SON, and outputs the logical AND signal thus generatedto the gate of the first ON transistor MON1. With such an arrangement,the first ON transistor MON1 can be turned off after both the first ONtransistor MON1 and the second ON transistor MON2 are turned on.

The first ON circuit 110 further includes a current limiting resistorR2. The current limiting resistor R2 is arranged on a path of the firstON transistor MON1, i.e., between the drain of the first ON transistorMON1 and the gate of the output transistor M1. By optimizing theresistance value of the current limiting resistor R2, such anarrangement is capable of optimizing the current ION1 that flows throughthe output transistor M1.

When the ON control signal SON is asserted, the second ON transistorMON2 of the second ON circuit 120 preferably generates a predeterminedconstant current ION2.

The second ON circuit 120 includes transistors M34 and M35, a constantcurrent source 122, and an inverter 124. The constant current source 122generates a constant current Ic. The transistor M34 is configured as aMOSFET that is of the same conduction type (N-channel MOSFET) as thesecond ON transistor MON2. The transistor M34 is arranged on a path forthe constant current Ic. The transistor M34 and the second ON transistorMON2 form a current mirror circuit. Such an arrangement generates asecond current ION2 obtained by multiplying the constant current Ic by k(k represents the mirror ratio).

In order to control the on and off operations of the second ONtransistor MON2, the transistor M35 is arranged between the gate and thesource of the second ON transistor MON2. The ON control signal #SON (“#”represents logical inversion), after being inverted by the inverter 124,is input to the gate of the transistor M35. When the ON control signalSON is asserted (set to high level), the transistor M35 is turned off,and the second ON transistor MON2 is turned on, thereby generating thesecond current ION2. When the ON control signal SON is negated (set tolow level), the transistor M35 is turned on, and the second ONtransistor MON2 is turned off, thereby cutting off the second currentION2.

The first clamp circuit 140 clamps the voltage difference between thegate of the output transistor M1 and the first terminal PVDD to apredetermined clamp value VCL1. The first clamp circuit 140 includes areverse-connected diode D1 between the gate and the source of the outputtransistor M1. The predetermined value VCL is equal to the Zener voltageVz of the diode D1.

The second clamp circuit 142 includes a bipolar transistor Q1 arrangedbetween the gate and the source of the output transistor M1, a resistorR3 arranged between the base and the emitter of the transistor Q1, and adiode D2 reverse-connected between the base and the collector of thetransistor Q1. The second clamp circuit 142 clamps the gate-sourcevoltage Vgs to a predetermined clamp value VCL2.

With the present embodiment, the relation VCL1<VCL2 is satisfied. Thefirst clamp value VCL1 is preferably set to a value which is smallerthan the maximum operating voltage of the gate-source voltage of theoutput transistor M1. Furthermore, the second clamp value VCL2 ispreferably set to a value which is smaller than the absolute maximumrating voltage of the gate-source voltage Vgs of the output transistorM1.

The above is the configuration of the output circuit 100. Next,description will be made regarding the operation thereof. FIG. 9 is atime chart which shows the operation of the output circuit 100 shown inFIG. 8.

At the time point t0, the ON control signal SON is asserted (set to highlevel), which instructs the output transistor M1 to switch on. Uponreceiving this instruction, both the first ON transistor MON1 and thesecond ON transistor MON2 are turned on. In this state, the currentION=ION1+ION2 flows through the first resistor R1.

The voltage drop Vgs that occurs at the first resistor R1 is representedby the following Expression. The gate voltage Vg of the outputtransistor M1 rapidly drops.Vgs=R1×(ION1+ION2)

At the time point t1, the gate-source voltage Vgs exceeds the thresholdvoltage Vt of the output transistor M1, whereby the output transistor M1switches on.

Subsequently, at the time point t2, the gate-source voltage Vgs reachesthe threshold voltage Vth1 set by the gate voltage monitoring unit 114.Subsequently, after the delay τ1 elapses, at the time point t3, the OFFsignal S12 is asserted (set to low level).

In the period of time from the time point t2 to the time point t3, asthe gate voltage Vg drops, the first clamp circuit 140 and the secondclamp circuit 142 operate, in this order. Thus, the gate voltage Vg isheld at a level equal to (Vdd−VCL2).

When the OFF signal S12 is asserted at the time point t3, the first ONtransistor MON1 switches off, and accordingly, the current ION thatflows through the first resistor R1 becomes equal to the second currentION2. As a result, the voltage drop that occurs at the first resistor R1becomes small. This gradually raises the gate voltage Vg of the outputtransistor M1.

When the ON control signal SON is negated (set to low level) at the timepoint t4, the second ON transistor MON2 is turned off. As a result, thevoltage drop that occurs at the first resistor R1 becomes substantiallyzero, thereby turning off the output transistor M1.

The above is the operation of the output circuit 100.

With the output circuit 100, immediately after the output transistor M1is instructed to switch on, the two ON circuits 110 and 120 are set tothe active state. This rapidly reduces the gate voltage Vg of the outputtransistor M1, thereby enabling the output transistor M1 to switch on athigh speed.

Furthermore, by setting the first ON circuit 110 to the inactive stateafter the output transistor M1 switches on, such an arrangement providesreduced power consumption. Furthermore, with such an arrangement, thegate-source voltage Vgs of the output transistor M1 can be set to avoltage which is lower than the maximum operating voltage thereof,thereby providing improved reliability.

FIG. 10 is a circuit diagram which shows a configuration of the outputcircuit according to a modification. An output circuit 100 a shown inFIG. 10 has the same configuration as that of the output circuit 100shown in FIG. 8, except for a first ON circuit 110 a. The circuitconfiguration of the output circuit 100 a, with the exception of thehigh-side transistor M1, will be referred to “high-side driver 30 d”.

The first ON circuit 110 a includes a delay circuit 116, instead of thegate voltage monitoring unit 114 shown in FIG. 8. The delay circuit 116generates an OFF signal S12 which is asserted (set to low level) after apredetermined period of time τ2 elapses after the ON control signal SONis asserted. For example, the delay circuit 116 may be configured as ananalog timer or a digital timer. Alternatively, the delay circuit 116and the AND gate 112 may be configured as a one-shot pulse circuit. Theone-shot pulse circuit is a circuit configured to generate a pulse whichis set to high level (or low level) for a predetermined period of time.

The output circuit 100 a according to such a modification shown in FIG.10 operates in the same way as shown in the time chart shown in FIG. 9.Thus, the output circuit 100 a according to the modification providesthe same advantages as those of the output circuit 100 shown in FIG. 8.

Description has been made regarding an embodiment of the presentinvention with reference to the second embodiment. The above-describedembodiment has been described for exemplary purposes only, and is by nomeans intended to be interpreted restrictively. Rather, it can bereadily conceived by those skilled in this art that variousmodifications may be made by making various combinations of theaforementioned components or processes, which are also encompassed inthe technical scope of the present invention. Description will be madebelow regarding such modifications.

Description has been made in the embodiment regarding an arrangement inwhich a P-channel MOSFET is employed as the output transistor M1 of thehigh-side block. Also, the present invention may be applied to anarrangement employing an N-channel MOSFET. Also, the present inventioncan be effectively applied so as to prevent a malfunction of a powertransistor in the low-side block in a half-bridge configuration or afull-bridge configuration.

In the configuration shown in FIG. 8 or FIG. 10, there is notnecessarily a need to provide the first clamp circuit 140 or the secondclamp circuit 142. In a case in which the breakdown voltage of theoutput transistor is sufficiently high, either one or both of the firstclamp circuit 140 and the second clamp circuit 142 may be eliminated.

For example, the output circuit 100 according to the second embodimentcan be suitably employed in motor drivers, switching regulators,lighting inverters for discharge lamps, etc.

Also, a combination of the first embodiment and the second embodiment isalso valid as an embodiment of the present invention. That is to say,the high-side driver 30 c shown in FIG. 8 or the high-side driver 30 dshown in FIG. 10 may be employed as the high-side driver 30 included inthe bridge output circuit 100 shown in FIG. 1. It is needless to saythat a portion of the configuration of the high-side driver 30 c or 30 d(e.g., the first clamp circuit 140, second clamp circuit 142) may beeliminated.

In this case, the transistor M3 shown in FIG. 1 is replaced by the OFFtransistor MOFF shown in FIG. 8 or FIG. 10. With such an arrangement,the same signal as the signal output to the gate of the transistor M3from the low-side driver 40 is input to the gate of the OFF transistorMOFF thus arranged. The ON control signal SON corresponds to the inputsignal SIN shown in FIG. 1. Furthermore, the inverter 124 shown in FIG.8 or FIG. 10 is replaced by the NAND gate 32 shown in FIG. 1.

Such a combination arrangement provides the advantages of both the firstembodiment and the second embodiment.

While the preferred embodiments of the present invention have beendescribed using specific terms, such description is for illustrativepurposes only, and it is to be understood that changes and variationsmay be made without departing from the spirit or scope of the appendedclaims.

1. A bridge output circuit configured to output, via an output terminal,an output signal having a voltage level that corresponds to a controlsignal, the bridge output circuit comprising: a high-side transistorarranged between a first fixed voltage terminal and the output terminal;a low-side transistor arranged between the output terminal and a secondfixed voltage terminal; a low-side off-detection circuit configured tocompare a gate signal of the low-side transistor with a predeterminedfirst level so as to detect whether or not the low-side transistor isoff, and to generate a low-side off-detection signal which is assertedwhen it is detected that the low-side transistor is off; a high-sideoff-detection circuit configured to compare a gate signal of thehigh-side transistor with a predetermined second level so as to detectwhether or not the high-side transistor is off, and to generate ahigh-side off-detection signal which is asserted when it is detectedthat the high-side transistor is off; a high-side driver configured togenerate the gate signal for the high-side transistor according to thecontrol signal and the low-side off-detection signal; a low-side driverconfigured to generate the gate signal for the low-side transistoraccording to the control signal and the high-side off-detection signal,and wherein the low-side off-detection circuit comprises a low-sidedetection transistor that is of the same type as the low-sidetransistor, a first terminal of which is connected to the second fixedvoltage terminal, and which is configured to receive, via a gatethereof, the gate signal of the low-side transistor, a first resistorarranged between a second terminal of the low-side detection transistorand a third fixed voltage terminal, and a first bypass circuit arrangedin parallel with the first resistor, and configured to be switched onwhen the control signal is set to a level which instructs the low-sidetransistor to switch off, and to be switched off when the control signalis set to a level which instructs the low-side transistor to switch on,and wherein a signal output via the second terminal of the low-sidedetection transistor is output as the low-side off-detection signal. 2.A bridge output circuit according to claim 1, wherein the first bypasscircuit comprises: a first bypass resistor having a smaller resistancevalue than that of the first resistor; and a first switch arranged inseries with the first bypass resistor, and configured to switch on andoff according to the control signal.
 3. A bridge output circuitaccording to claim 1, wherein the high-side off-detection circuitcomprises: a high-side detection transistor that is of the same type asthe high-side transistor, and arranged such that a first terminalthereof is connected to the first fixed voltage terminal, and the gatesignal of the high-side transistor is received via a gate thereof; asecond resistor arranged between a second terminal of the high-sidedetection transistor and a fourth fixed voltage terminal; and a secondbypass circuit arranged in parallel with the second resistor, andconfigured to be switched on when the control signal is set to the levelwhich instructs the high-side transistor to switch off, and to beswitched off when the control signal is set to the level which instructsthe high-side transistor to switch on, and wherein a signal output viathe second terminal of the high-side detection transistor is output asthe high-side off-detection signal.
 4. A bridge output circuit accordingto claim 3, wherein the second bypass circuit comprises: a second bypassresistor having a smaller resistance value than that of the secondresistor; and a second switch arranged in series with the second bypassresistor, and configured to switch on and off according to the controlsignal.